HANDLING AND POSITIONING UNIT
A highly complex and precise module for semiconductor assembly („die bonding“).
This 5 axis unit consists of over 1000 individual parts, it is built in 4 options and it is used for high dynamic feeding and positioning of substrates with micrometer accuracy during chip manufacturing or packaging.
A highly complex and precise module for semiconductor assembly („die bonding“).
This 5 axis unit consists of over 1000 individual parts, it is built in 4 options and it is used for high dynamic feeding and positioning of substrates with micrometer accuracy during chip manufacturing or packaging.









