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HEATING AND POSITIONING UNIT
A highly complex precision module used in the manufacturing of semi-conductor chips („wire bonding“).
This unit consists of over 300 single components. The unit uses 3 axes and a heating plate to position substrates with micrometer precision and guarantees precise tempering of the substrates.
A highly complex precision module used in the manufacturing of semi-conductor chips („wire bonding“).
This unit consists of over 300 single components. The unit uses 3 axes and a heating plate to position substrates with micrometer precision and guarantees precise tempering of the substrates.
| Heating and positioning unit | 1.1 MB |  |
